SKY65342-11 Datasheet, PDF (11/13 Pages) Skyworks Solutions Inc. – 450-470 MHz Front-End Module

Stencil aperture 60-80% of
module/pkg solder mask area
DATA SHEET • SKY65342-11 FRONT-END MODULE
8.685
2X 1.65 12X 0.81
12X 1.043
2X 1.91
CL
8.685
CL
Stencil Aperture
Top View
Component
Outline
Pin 12
11X 1.043
Pin 1
8.685
1.91 Typ
0.25
Thermal Via Array ∅0.3 mm on 1.0 mm pitch.
Additional vias in common ground pad
will improve thermal performance.
NOTE: It is recommended that thermal vias
should be filled with 30-35 μm Cu plating.
All measurements are in millimeters
8.685
6X 0.81
1.65 Typ
Pin 12
∅5.080 Solder
Mask Opening
Pin 1
CL
8.785
1.65
CL
Metallization
Top View
Component
Outline
CL
Solder Mask Opening
Top View
Figure 12. SKY65342-11 Phone Board Layout Footprint
12X 1.143
12X 0.91
CL
8.785
1.91 Typ
Component
Outline
S1357
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
201139C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 26, 2009
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