SKY65099-360LF Datasheet, PDF (5/13 Pages) Skyworks Solutions Inc. – 700 to 2700 MHz Broadband Linear Amplifier Driver

DATA SHEET • SKY65099-360LF: BROADBAND LINEAR AMPLIFIER DRIVER
Evaluation Board Description
The Skyworks SKY65099-360LF Evaluation Board is used to test
the performance of the SKY65099-360LF PA driver. A schematic
of the Evaluation Board is shown in Figure 3. Table 7 lists the Bill
of Materials (BOM) with component values for the Evaluation
Board.
An assembly drawing for the Evaluation Board is shown in
Figure 4, and the layer detail is provided in Figure 5. The layer
detail phyiscal characteristics are shown in Figure 6.
Capacitor C10 provides DC decoupling, and C8 and C9 provide RF
bypass for the PA. Pin 3 is the RF input port and pins 6 and 7 are
the RF output ports.
External DC blocking is required on the input and output, but can
be implemented as part of the RF matching circuit. Ground pin 2
and the center ground pad provide the DC and RF ground.
Testing Procedure
Use the following procedure to set up the SKY65099-360LF
Evaluation Board for testing:
1. Connect a 5.0 V supply to the VCC pin of the J3 header (see
Evaluation Board assembly drawing in Figure 4 and schematic
diagram in Figure 3). If available, enable the current limiting
function of the power supply to 500 mA.
2. Connect a signal generator to the RF signal input port. Set it to
the desired RF frequency at a power level of –15 dBm or less
to the Evaluation Board but do NOT enable the RF signal.
3. Connect a spectrum analyzer to the RF signal output port.
4. Enable the power supply.
5. Enable the RF signal.
6. Take measurements.
Circuit Design Configurations
The following design considerations are general in nature and
must be followed regardless of final use or configuration.
 Paths to ground should be made as short as possible.
 The ground pad of the SKY65099-360LF power amplifier has
special electrical and thermal grounding requirements. This pad
is the main thermal conduit for heat dissipation. Since the
circuit board acts as the heat sink, it must shunt as much heat
as possible from the amplifier. As such, design the connection
to the ground pad to dissipate the maximum wattage produced
to the circuit board. Multiple vias to the grounding layer are
required.
NOTE: Junction temperature (Tj) of the device increases with a
poor connection to the ground pad and ground. This
reduces the life of the device.
CAUTION: If any of the output signals exceed the rated
maximum values, the SKY65099-360LF Evaluation
Board can be permanently damaged.
R1
C11
1
REXT1
2 _GND
J1
C0
3
RFIN
C1
C2
C3
× ⁴ N/U
8
REXT2
RFOUT2 ⁷
C5
C7
J2
RFOUT1 ⁶
C4
C6
N/U ⁵ ×
L1
J3 Header 5
1
GND
GND ²
GND ³
VCC ⁴
GND ⁵
C8
C9
C10
S3034
Figure 3. SKY65099-360LF Evaluation Board Schematic
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
202024C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 10, 2015
5