SKY77324 Datasheet, PDF (16/24 Pages) Skyworks Solutions Inc. – iPAC PAM for Quad-Band GSM / GPRS

DATA SHEET • SKY77324
iPAC™ PAM FOR QUAD-BAND GSM / GPRS
Figure 6. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77324 is currently qualified for MSL3/240 °C.
Demonstration of the SKY77324 to withstand an MSL3/250 °C
solder reflow is pending completion of qualification tests.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment. If the
part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second; maximum temperature should
not exceed 250 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to
temperatures exceeding 250 °C for more than 10 seconds.
For details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD-020B.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Application
Note: Tape and Reel, Document Number 101568.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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January 7, 2004 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 103123C