SKY77328 Datasheet, PDF (15/19 Pages) Skyworks Solutions Inc. – iPAC PAM for Quad-Band GSM/GPRS

SKY77328 iPAC™ PAM FOR QUAD-BAND GSM / GPRS
DATA SHEET
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77328 is capable of withstanding an MSL3/260 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second; maximum temperature
should not exceed 260 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 260 °C for more than 10 seconds. For
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020B.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel – RF Modules, Document
Number 101568.
Electrostatic Discharge Sensitivity
The SKY77328 has been classified as a Human Body Model Class
1C (1000 volts to < 2000 volts) and Machine Model Class M2
(100 volts to < 200 volts) device. ESD testing has been performed
in compliance to the latest JEDEC Human Body Model
specification, HBM (JESD22-A114-B) and Machine Model
specification, (JESD22-A115-A). A report summarizing the ESD
testing, including ESD failure level thresholds on each pin-to-
ground and pin-to-pin combination may be obtained upon
request.
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the Class-1 ESD
handling precautions listed below.
• Personnel Grounding
- Wrist Straps
- Conductive Smocks, Gloves and Finger Cots
- Antistatic ID Badges
• Protective Workstation
- Dissipative Table Top
- Protective Test Equipment (Properly Grounded)
- Grounded Tip Soldering Irons
- Solder Conductive Suckers
- Static Sensors
• Facility
- Relative Humidity Control and Air Ionizers
- Dissipative Floors (less than 10⁹ Ω to GND)
• Protective Packaging and Transportation
- Bags and Pouches (Faraday Shield)
- Protective Tote Boxes (Conductive Static Shielding)
- Protective Trays
- Grounded Carts
- Protective Work Order Holders
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
103237A • Skyworks Proprietary and Confidential Information • Products and product information are subject to change without notice. • March 17, 2009
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