SKY65006-348LF Datasheet, PDF (14/15 Pages) Skyworks Solutions Inc. – 2.4-2.5 GHz WLAN/Zigbee Power Amplifier

Data Sheet • SKY65006-348LF
Evaluation Board Stack-Up
MSK-NS
TRA-NS
Via Plating
Thru Both Boards
See Note 3
0.254
Ref.
Circuit Board
See Note 1a
1.5747 ± 0.127
Copper Side
of Backing
TRA-2
TRA-FS
MSK-FS
Circuit Board Backing
See Note 1b
Detail A
Notes:
Units = mm.
1. Material:
1a. Circuit board: FR4, 0.254 mm thick, 1 oz finished copper TRA-NS layer,
1/2 oz finished copper TRA-2 layer.
1b. Circuit board backing: FR4 prepreg, 1 oz copper one side.
1c. Laminate the unmetalized side of backing to bottom of circuit board for a total
thickness of 1.5747 ± 0.127 mm. (See Detail A)
2. Plating: 200 microinches of nickel, and 50–100 microinches of soft gold.
3. Via plating: Cu plate 0.001 to 0.0015 thru both boards.
4. RF lines marked with * to be finished width of 0.50 mm measured at bottom of trace
(trace to board interface).
All line width tolerances ± 0.025 mm.
All rubout tolerances ± 0.025 mm.
5. Silk-screen reference designators approximately as shown.
6. Separate boards with router.
Recommended Solder Reflow Profiles
Refer to the “Recommended Solder Reflow Profile”
Application Note.
Tape and Reel Information
Refer to the “Discrete Devices and IC Switch/Attenuators
Tape and Reel Package Orientation” Application Note.
Device Branding Specifications
Pin 1
Indicator
Pin 16
S006
Skyworks P/N
Pin 1
XXXX
Lot #
YXX
Top View
Date Code
Y = Calendar Year
WW = Week
Package Footprint
16X 1.10
12X 0.50 Pitch
0.25
Metal GND Pad (Sq.) 1.45
4X Plated
Thru Via
See Detail A
0.23
0.60
Exposed
Solder Area
Units = mm
Detail A
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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November 19, 2008 • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • 200122 Rev. H