SKY65364-21 Datasheet, PDF (12/14 Pages) Skyworks Solutions Inc. – High-efficiency PA

DATA SHEET • SKY65364-21: T/R FRONT-END MODULE
0.5
0.4
0.15
0.05 _0.05
6.3
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
0.8 0.9
8X 0.062
6.3
16X 0.875
8X 0.063
16X 0.875
Stencil Aperture
Top View
0.9
0.8
0.05
0.05
Package Outline
0.15
Stencil and
Metallization
Solder Mask Opening
SMT Pad Detail
Scale: 2X
6X This Rotation
6X Rotated 180°
6X Rotated 90° CW
6X Rotated 90° CCW
Package Outline
6.4
3.875
0.85 0.75
Package Outline
6.4 3.875
Solder Mask Opening
SMT Pad Detail
Scale: 2X
1X This Rotation
1X Rotated 180°
(6.3)
Stencil and
Metallization
Solder Mask Opening
Top View
Pin 28
Pin 1
(1.5)
0.25 Typ.
The cross-hatched area represents the merger
of the center ground pad +12 individual I/O
ground pads. All I/O ground pads should have
at least one via connected to internal ground
0.9
planes for optimum electrical performance.
0.8
Package Outline
(10X 0.75 Pitch)
Package Outline
0.05
0.05
(6.3)
(1.2)
(10X 0.725 Pitch)
All measurements are in millimeters
Metallization
Top View
0
4X 0.375
4X 1.125
4X 1.875
2X 2.750
Package Outline
0.15
Stencil and
Metallization
Solder Mask Opening
Thermal Via Array.
∅0.3 mm on 0.6 mm pitch.
Additional vias in common ground
pad will improve thermal and electrical
performance. NOTE: thermal vias
should be tented and filled with solder
mask, 30-35 μm Cu plating recommended.
0.75 0.85
SMT Pad Detail
Scale: 2X
1X This Rotation
1X Rotated 180°
203189E-007
Figure 7. SKY65364-21 Footprint Drawing and Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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May 24, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203189F