SKY77149_06 Datasheet, PDF (11/13 Pages) Skyworks Solutions Inc. – PA Module for CDMA / PCS (1850-1910 MHz)

PA MODULE FOR CDMA / PCS (1850–1910 MHz)
DATA SHEET • SKY77149
VREF ₁
8 ^GND
VCONT ₂
7 ^GND
RF_IN 3
6 RF_OUT
VCC1 ⁴
GROUND PAD
5 VCC2
Pad layout as seen from top view looking through the package.
GROUND PAD is package underside.
103062_013
Figure 13. SKY77149 Pin Names and Configuration (Top View)
Pin 1
Identifier
Lot
Number
Year of
Manufacture
Week
Package
Sealed
77149-N
XXXXX.X
YYWW MX
Figure 14. Typical Case Markings
Part
Number
Revision
Number
Country
Code
103062_014
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
The SKY77149 is a Class 2 device. Figure 15 lists the Electrostatic
Discharge (ESD) immunity level for each non-ground pin of the
SKY77149 product. The numbers in Figure 15 specify the ESD
threshold level for each pin where the I-V curve between the pin
and ground starts to show degradation.
The ESD testing was performed in compliance with
MIL-STD-883E Method 3015.7 using the Human Body Model. If
ESD damage threshold magnitude is found to consistently exceed
2000 volts on a given pin, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pin fails the electrical
specification limits” or “the pin becomes completely non-
functional”. Skyworks employs most stringent criteria and fails
devices as soon as the pin begins to show any degradation on a
curve tracer.
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77149 is capable of withstanding an MSL3/250 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 250 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 250 °C for more than 10 seconds. For
VREF
> + 2 kV
1
< – 2 kV
8 GND
VCONT
> + 2 kV
2
< – 2 kV
7 GND
RF_IN
> + 2 kV
3
< – 2 kV
RF_OUT
6
> + 2 kV
< – 2 kV
VCC1
> + 2 kV
4
< – 2 kV
GROUND PAD
VCC2
5
> + 2 kV
< – 2 kV
Pad layout as seen from top view looking through the package.
103062_015
Figure 15. ESD Sensitivity Areas (Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
103062B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 6, 2006
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