SKY77149_06 Datasheet, PDF (10/13 Pages) Skyworks Solutions Inc. – PA Module for CDMA / PCS (1850-1910 MHz)

DATA SHEET • SKY77149
PA MODULE FOR CDMA / PCS (1850–1910 MHz)
0.6
0.4
0.8 TYP
PCB SYMBOL FOR 3.0 x 3.0 mm PACKAGE CX77149 & CX77154 SPECIFIC
1.2
0.6
0.4
2.3
0.8 TYP
1.3
0.7
0.15
3.2
STENCIL APERTURE
TOP VIEW
APPROACH 1
COMPONENT
OUTLINE
COMPONENT
OUTLINE
3.2
STENCIL APERTURE
TOP VIEW
APPROACH 2
0.6
COMMON GROUND
PAD
COMPONENT
OUTLINE
0.4
0.25
0.8 TYP
COMPONENT
OUTLINE
0.7
0.5
0.05 ALL AROUND
0.8 TYP
4 X R0.5
2.55
0.25
3.2
METALLIZATION
TOP VIEW
Thermal Via Array
Ø0.3 mm on 0.5 mm Pitch
Additional Vias will improve
thermal performance.
NOTE: Thermal Vias Should be
Tented and Filled with Solder Mask
30-35 µm Cu Plating Recommended.
1.3
3.3
SOLDER MASK OPENING
TOP VIEW
All dimensions are in millimeters.
Figure 12. Phone PCB Layout Footprint Diagram for 3 x 3 mm, 8-Pin Package – SKY77149
103062_012
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
10
November 6, 2006 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 103062B