SKY65152-11 Datasheet, PDF (11/14 Pages) Skyworks Solutions Inc. – 2.4-2.5 GHz WLAN Power Amplifier

DATA SHEET • SKY65152-11 POWER AMPLIFIER
VCC1 (pin 16). Supply voltage for the first stage collector bias
(typically +5 V). To bypass VCC1, capacitors C5 and C15 (see
Figure 15) should be placed in the approximate location shown on
the Evaluation Board, although exact placement is not critical.
RF_IN (pin 18). Amplifier RF input pin (ZO = 50 Ω). The module
includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
Package Dimensions
The PCB layout footprint for the SKY65152-11 is shown in
Figure 19. Typical case markings are shown in Figure 20.
Package dimensions for the 20-pin MCM are shown in Figure 21,
and tape and reel dimensions are provided in Figure 22.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
THE SKY65152-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 qC. It can be used for lead or lead-free soldering.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel Information – RF Modules,
document number 101568.
Thermal Via Array Ø0.3 mm
On 0.6 mm Pitch
Improves Thermal Performance
Pin 20
Pin 1
0.25 Typ.
6.3
1 Typ.
13X 0.75
13X 0.5
0.6 Typ.
Pin 20
Pin 1
Package Outline
20X 0.85
20X 0.6
0.6 Typ.
6.3
Metallization
Top View
Pin 20
Pin 1
20X 0.75
20X 0.5
1 Typ.
Package Outline
2X 1.7
6.4
Solder Mask Opening
Top View
2X 1.7
6.4
6.3
1 Typ.
Package Outline
2X 1.7
6.3
Stencil Aperture
Top View
2X 1.7
Stencil Aperture Size of
80 to 100% of the
Module/Pkg. Solder
Mask Opening
All dimensions are in millimeters
S1507
Figure 19. SKY65152-11 PCB Layout Footprint
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
200968F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 19, 2009
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