CGA-6618 Datasheet, PDF (8/8 Pages) Stanford Microdevices – DUAL CATV BROADBAND HIGH LINEARITY GAAS HBT AMPLIFIER

CGA-6618 Dual GaAs HBT Amplifier
PCB Pad Layout
Dimensions in inches [millimeters]
Sized for 31 mil thick FR-4
Nominal Package Dimensions & Package Marking
Dimensions in inches [millimeters]
Refer to package drawing posted at www.sirenza.com for tolerances.
TOP VIEW
8
7
6
5
BOTTOM VIEW
Lot Code
CGA6618 ^{.155 [3.937] .236 [5.994]}
1234
.061 [1.549]
.112
[2.85]
.194 [4.93]
.088 [2.25]
EXPOSED PAD
.050 [1.27]
.016 [.406]
.061 [1.549]
.008 [.203]
.058 [1.473] ^{.013 [.33] x 45°}
DETAIL A
.008
PARTING LINE
.194 [4.928]
SIDE VIEW
.003 [.076]
SEATING PLANE
SEE DETAIL A
.155 [3.937]
END VIEW
.025
5°
303 S. Technology Ct., Broomfield, CO 80021
Phone: (800) SMI-MMIC
8
http://www.sirenza.com
EDS-101994 Rev J