SLX-2143 Datasheet, PDF (7/7 Pages) List of Unclassifed Manufacturers – 1700-2200 MHz High Linearity Low Noise Amplifier Module

Figure 1: Evaluation Board Layout
Preliminary
SLX-2143 1700-2200 MHz LNA Module
Solder Reflow
The module is designed to be soldered onto a pad that
has an array of via holes for improved grounding. Note that
the module is reasonably tolerant of voids in the solder cov-
erage on the back, but that voids should be avoided
because they can result in an increase in thermal imped-
ance, which will result in the module running too hot. The
gold content on the back is very small so solder embrittle-
ment will not be a problem.
The module can be assembled onto a circuit board
using standard oven or IR reflow profiles. It is difficult to rec-
ommend any single reflow profile because such profiles
depend on the board size, other components on the board,
and the reflow equipment in use. The most critical parame-
ter is the peak temperature. Reflow profiles that have a
peak temperature on the order of 220ºC-240ºC for 30 sec-
onds will be adequate for this part. Lower peak tempera-
tures can be used if the time is increased. For small volume
prototype fabrication and rework, a hot plate running at
about 250ºC is recommended, with the part left on only until
the solder reflows. Soldering irons are not recommended
for mounting or removing the part.
There is a thermal coefficient of expansion mismatch
between the module and typical circuit board material, but
the small dimensions of the module make the strain
induced into the module minimal, so no stress related prob-
lems should be encountered. If the module is mounted on a
very thin laminate (such as FR-4 0.032” (0.81mm) or less),
then care should be taken to avoid flexing the laminate, as
the ceramic substrate could crack. This has not been
observed on conventional thick circuit board materials. (The
evaluation board is a three layer structure with two .032”
thick dielectric layers.)
Conclusion
The SLX-2143 has been designed to be both easy to
use and robust, and lab tests done at Sirenza Microdevices
have repeatedly demonstrated this. By following the guide-
lines in this application note, excellent performance can be
achieved. We hope that this application note and the prod-
ucts offered by Sirenza Microdevices will assist you in
achieving your design goals. If there are any questions
about this module or any other Sirenza Microdevices part,
please contact us at [e-mail].
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
7
http://www.sirenza.com
EDS-102501 Rev B