SP42450 Datasheet, PDF (4/10 Pages) SIPAT Co,Ltd – SP5T Absorptive Silicon-on-Sapphire

Evaluation Kit
The SP5T switch EK Board was designed to ease customer
evaluation of SP42450. The RF common port is connected
through a 50 Ω transmission line via the top SMA connector.
RF1, RF2, RF3 and RF4 are connected through 50 Ω
transmission lines via side SMA connectors. A through 50 Ω
transmission is available via SMA connectors RFCAL1 and
RFCAL2. This transmission line can be used to estimate the
loss of the PCB over the environmental conditions being
evaluated.
The EVK board is constructed with four metal layers on
dielectric materials of Rogers 4003C and 4450 with a total
thickness of 32 mils. Layer 1 and layer 3 provide ground for
the 50 ohm transmission lines. The 50 ohm transmission
lines are designed in layer 2 for high isolation purpose and
use a stripline waveguide design with a trace width of 9.4
mils and trace metal thickness of 1.8 mils. The board stack
up for 50 ohm transmission lines has 8 mil thickness of
Rogers 4003C between layer 1 and layer 2, and 10 mil
thickness of Rogers 4450 between layer 2 and layer 3. Please
consult manufacturer's guidelines for proper board material
properties in your application. The PCB should be designed
in such a way that RF transmission lines and sensitive DC i/o
traces such as Vss_EXT are heavily isolated from one another,
otherwise the true performance of the SP42450 will not be
yielded.
SP42450
High-Isolation RF Switch
Figure 4. Evaluation Board Layouts
Figure 5. Evaluation Board Schematic
RFC
2
RF5
1
RF5
RF4
1
RF4
1 _GND
2 _RF5
3 _GND
4 _GND
5 _RF4
6 _GND
U1
PE4245x_24L_QFN
V2 ¹⁸
V1 ¹⁷
VDD ¹⁶
GND ¹⁵
RF1 ¹⁴
GND ¹³
RF1
RF1
1
R1
0 OHM
R2
C1
DNI
1M
R3
0 OHM
C2
R4
100pF
1M
R5
0 OHM
C3
R6
100pF
1M
R7
0 OHM
C4
100pF
R9
0 OHM
C5
100pF
R8
1M
C6
1µF
VSS
VDD
V3
V2
V1
J1
HEADER 14
13 ₁₃
11 ₁₁
99
77
55
33
11
14 ¹⁴
12 ¹²
10 ¹⁰
88
66
44
22
USE PCB 101-0479-03
RF3
1
RF3
RF2
RF2
1
RFCAL1
1 ^RF
RF CAL
STRIPLINE
RFCAL2
1
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