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SP4304 Datasheet, PDF (2/10 Pages) SIPAT Co,Ltd – 75 Ω RF Digital Attenuator
SP4304
Product Specification
Figure 3. Pin Configuration (Top View)
C16 1
RF1 2
Data 3
Clock 4
LE 5
20-lead QFN
4x4mm
Exposed Solder Pad
15 C8
14 RF2
13 P/S
12 Vss/GND
11 GND
Table 2. Pin Descriptions
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Paddle
Pin
Name
C16
RF1
Data
Clock
LE
VDD
PUP1
PUP2
VDD
GND
GND
Vss/GND
P/S
RF2
C8
C4
C2
GND
C1
C0.5
GND
Description
Attenuation control bit, 16dB (Note 4).
RF port (Note 1).
Serial interface data input (Note 4).
Serial interface clock input.
Latch Enable input (Note 2).
Power supply pin.
Power-up selection bit, MSB.
Power-up selection bit, LSB.
Power supply pin.
Ground connection.
Ground connection.
Negative supply voltage or GND
connection(Note 3)
Parallel/Serial mode select.
RF port (Note 1).
Attenuation control bit, 8 dB.
Attenuation control bit, 4 dB.
Attenuation control bit, 2 dB.
Ground connection.
Attenuation control bit, 1 dB.
Attenuation control bit, 0.5 dB.
Ground for proper operation
Note 1: Both RF ports must be DC blocked with an external series
capacitor or held at 0 VDC.
2: Latch Enable (LE) has an internal 100 kΩ resistor to VDD.
3: Connect pin 12 to GND to enable internal negative voltage
generator. Connect pin 12 to VSS (-VDD) to bypass and
disable internal negative voltage generator.
4. Place a 10 kΩ resistor in series, as close to pin as possible.
Table 3. Absolute Maximum Ratings
Symbol Parameter/Conditions Min Max Units
VDD
Power supply voltage
-0.3 4.0
V
VI
Voltage on any input
-0.3
VDD+
0.3
V
TST
Storage temperature range -65 150
°C
PIN
Input power (50Ω)
VESD
ESD voltage (Human Body
Model)
+30 dBm
500
V
Table 4. Operating Ranges
Parameter
VDD Power Supply
Voltage
IDD Power Supply
Current
Digital Input High
Min Typ
2.7
3.0
0.7xVDD
Digital Input Low
Digital Input Leakage
Max
3.3
100
0.3xVDD
1
Units
V
µA
V
V
µA
Input Power
Temperature range
-40
+24
dBm
85
°C
Exposed Solder Pad Connection
The exposed solder pad on the bottom of the
package must be grounded for proper device
operation.
Electrostatic Discharge (ESD) Precautions
When handling this CMOS device, observe
the same precautions that you would use with other
ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the rate specified in Table 3.
Latch-Up Avoidance
Unlike conventional CMOS devices, CMOS
devices are immune to latch-up.
Switching Frequency
The SP4304 has a maximum 25 kHz switching rate.
Resistor on Pin 1 & 3
A 10 kΩ resistor on the inputs to Pin 1 & 3 (see
Figure 5) will eliminate package resonance between
the RF input pin and the two digital inputs. Specified
attenuation error versus frequency performance is
dependent upon this condition.
Tel: +86-23-62808818
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Fax: +86-23-62805284 www.sipatsaw.com / sawmkt@sipat.com