SSF3055 Datasheet, PDF (3/3 Pages) Silikron Semiconductor Co.,LTD. – Battery protection

SSF3055
TO-252 PACKAGE INFORMATION
NOTES：
1. No current JEDEC outline for this package.
2. L3 and b3 dimensions establish a minimum mounting surface for terminal 3.
3. Dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. L1 is the terminal length for soldering.
6. Position of lead to be measured 0.090 inches (2.28mm) from bottom of dimension D.
7. Controlling dimension: Inch.
©Silikron Semiconductor CO.,LTD.
2008.7.29
Version : 1.0
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