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SSFM8005 Datasheet, PDF (1/7 Pages) Silikron Semiconductor Co.,LTD. – Advanced trench MOSFET process technology | |||
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Main Product Characteristics:
SSFM8005
VDSS
80V
RDS(on)
4.5mohm
ID
180A
Features and Benefits:
TO-220AB
 Advanced trench MOSFET process technology
 Special designed for PWM, load switching and general purpose applications
 Ultra low on-resistance with low gate charge
 Fast switching and reverse body recovery
 175â operating temperature
Description:
It utilizes the latest FRRMOS (fast reverse recovery MOS) trench processing techniques to achieve
extremely low on resistance, fast switching speed and short reverse recovery time. These features
combine to make this design an extremely efficient and reliable device for use in PWM, load switching
and a wide variety of other applications
Absolute max Rating:
Symbol
Parameter
ID @ TC = 25°C Continuous Drain Current, VGS @ 10Vâ
ID @ TC = 100°C Continuous Drain Current, VGS @ 10Vâ
IDM
ISM
PD @TC = 25°C
PD @TC =100°C
Pulsed Drain Currentâ¡
Pulsed Source Current (Body Diode)â¡
Power Dissipationâ¢
Power Dissipationâ¢
VDS
Drain-Source Voltage
VGS
EAS
IAR
Gate-to-Source Voltage
Single Pulse Avalanche Energy @ L=0.1mHâ¡
Avalanche Current @ L=0.1mHâ¡
TJ TSTG
Operating Junction and Storage Temperature
Range
Max.
180
135
500
500
346
178
80
± 25
450
95
-55 to + 175
Units
A
W
W
V
V
mJ
A
°C
Thermal Resistance
Symbol
RθJC
RθJA
Characterizes
Junction-to-caseâ¢
Junction-to-ambient (t ⤠10s) â£
Junction-to-Ambient (PCB mounted, steady-state) â£
Value
0.34
12
55
Unit
â/W
â/W
â/W
©Silikron Semiconductor CO.,LTD.
2010.12.14
www.silikron.com
Version : 3.0
page 1of7
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