SI5020C-BA Datasheet, PDF (8/14 Pages) Silicon Laboratories – Si5020 MICRO PCB WITH S3050 FOOTPRINT

Si5020C-BA
High-Speed Serial Input
the reflow process.
The high-speed serial data inputs (SERDATIP/N)
provide data to the Si5020 for clock and data recovery.
The SERDATIP/N inputs are internally biased to an
input common mode voltage of 2.0 V and provide 100 Ω
line-to-line termination. AC coupling is recommended as
the simplest coupling approach. (See "Typical
Application Schematic" on page 6.) Full details on the
SERDATIP/N pins can be found in the Si5020 data
sheet DIN± pin descriptions.
Recovered Data Output
The recovered data outputs (SERDATOP/N) transmit
the recovered serial data. These outputs are time
aligned to the recovered clock outputs.
The SERDATOP/N outputs are current mode logic
(CML) outputs. AC coupling is recommended as the
simplest coupling approach. (See "Typical Application
Schematic" on page 6.) Full details on the SERDATOP/
N pins can be found in the Si5020 data sheet DOUT±
pin descriptions.
Recovered Clock Output
The recovered clock outputs (SERCLKOP/N) transmit
the clock recovered from the serial data. These outputs
are time aligned to the recovered data outputs.
The SERCLKOP/N outputs are CML outputs. AC
coupling is recommended as the simplest coupling
approach. (See "Typical Application Schematic" on
page 6.) Full details on the SERCLKOP/N pins can be
found in the Si5020 data sheet CLKOUT± pin
descriptions.
Soldering/Assembly
The Si5020C-BA employs a minimal lead length which
is significantly different from a QFP lead. Despite the
lead differences, handling of the Si5020C-BA is similar
to handling of a QFP. Automation of the alignment and
soldering processes will simplify the attachment.
Alignment can be accomplished using standard pick-
and-place machines. Set the pick point to the center of
the Si5020 device; this point is marked within the
mechanical drawing. (See Figure 2 on page 12.) Once
aligned, soldering the Si5020C-BA to another PCB is
best accomplished using solder paste and a reflow
chamber. Once the Si5020C-BA is placed upon the
solder paste the reflow process can occur.
The Si5020C-BA evaluation board itself has been
assembled using 220 °C solder in order maintain the
locations of the Si5020 device, voltage regulator,
inverter, and passive components on the board during
8
Rev. 1.0