EFM32WG360 Datasheet, PDF (63/75 Pages) Silicon Laboratories – Operation from backup battery when main power drains out

4.5 CSP81 Package
Figure 4.3. CSP81
...the world's most energy friendly microcontrollers
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. Primary datum “C” and seating plane are defined by the spherical crowns of the solder balls.
4. Dimension “b” is measured at the maximum solder bump diameter, parallel to primary datum “C”.
5. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body
Components.
Table 4.4. CSP81 (Dimensions in mm)
Symbol
Min
Nom
Max
A A1 A2 b S D E e D1 E1 n
0.491 0.17 0.036 0.23 0.3075
0.55 -
-
-
0.31
4.355 4.275
BSC. BSC.
0.40
BSC.
3.20
BSC.
3.20
BSC.
81
0.609 0.23 0.044 0.29 0.3125
aaa bbb ccc ddd eee
0.05 0.10 0.075 0.15 0.05
All EFM32 packages are RoHS compliant and free of Bromine (Br) and Antimony (Sb).
For additional Quality and Environmental information, please see:
http://www.silabs.com/support/quality/pages/default.aspx
2014-10-15 - EFM32WG360FXX - d0283_Rev1.00
63
www.silabs.com