SI7015-A10 Datasheet, PDF (4/39 Pages) Silicon Laboratories – Excellent long term stability

Si7015-A10
1. Electrical Specifications
Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.
Table 1. Recommended Operating Conditions
Parameter
Symbol Test Condition
Min
Typ
Max
Unit
Power Supply
VDD
1.9
—
3.6
V
Operating Temperature
TA
F grade
0
—
+70
°C
Operating Temperature
TA
G grade
–40
—
+85
°C
Table 2. General Specifications
1.9 < VDD < 3.6 V; TA = –40 to 85 °C (G grade) or 0 to 70 °C (F grade); default conversion time unless otherwise noted.
Parameter
Input Voltage High
Input Voltage Low
Input Voltage Range
Symbol
V_IH
VIL
VIN
Test Condition¹
AD0, SCL, SDA pins
AD0, SCL, SDA pins
SCL, SDA, RSTb pins with respect to
GND
Min
0.7xVDD
—
0.0
Typ
Max Unit
—
—
V
—
0.3xVDD V
—
VDD
V
Input Leakage
IIL
SCL, SDA pins; V_IN = GND
CS pin (200K nominal pull up);
Vin = GND
—
—
5xVDD
1
μA
μA
Output Voltage Low VOL SDA pin; IOL = 2.5 mA; VDD = 3.3 V
—
SDA pin; IOL = 1.2 mA;
—
VDD = 1.9 V
Current
Consumption
I_DD
RH conversion in progress
—
Temperature conversion in progress
—
—
0.6
V
—
0.4
V
150
180
µA
90
120
µA
CS < V_IL; no conversion in progress;
—
V_DD = 3.3 V;
SDA = SCL ≥ V_IH; HEAT = 1
Standby², –40 to +85°C
—
Peak IDD during powerup³
—
Peak IDD during I²C operations⁴
—
24
—
mA
0.06
0.62 µA
3.5
4.0
mA
3.5
4.0
mA
Conversion Time
t_CONV
RH Normal (Fast = 0)
RH Fast (Fast = 1)
—
5.8
7.0
ms
—
2.6
3.1
ms
Temperature Normal (Fast = 0)
—
4.0
6.2
ms
Temperature Fast (Fast = 1)
—
1.5
2.4
ms
Notes:
1. Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will
be t_CONV(RH) + t_CONV(T).
2. No conversion or I²C transaction in progress. Typical values measured at 25 °C.
3. Occurs once during powerup. Duration is <5 msec.
4. Occurs during I²C commands for Read Device ID and Read Firmware Version. Duration is < 100 µs when I²C clock
speed is >100 kHz.
4
Rev. 1.0