SI7006-A10 Datasheet, PDF (4/34 Pages) Silicon Laboratories – Excellent long term stability

Si7006-A10
1. Electrical Specifications
Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.
Table 1. Recommended Operating Conditions
Parameter
Symbol Test Condition
Min
Typ
Power Supply
VDD
1.9
—
Operating Temperature
TA
–40
—
Max
Unit
3.6
V
+125
°C
Table 2. General Specifications
1.9 < VDD < 3.6 V; TA = –40 to 125 °C default conversion time unless otherwise noted.
Parameter
Symbol
Test Condition
Min
Typ
Max Unit
Input Voltage High
V_IH
Input Voltage Low
VIL
SCL, SDA pins
SCL, SDA pins
0.7xVDD
—
—
V
—
—
0.3xVDD V
Input Voltage Range VIN SCL, SDA pins with respect to GND
0.0
—
VDD
V
Input Leakage
IIL
SCL, SDA pins
—
—
1
μA
Output Voltage Low VOL SDA pin; IOL = 2.5 mA; VDD = 3.3 V
—
—
0.6
V
SDA pin; IOL = 1.2 mA;
VDD = 1.9 V
—
—
0.4
V
Current
Consumption
Heater Current⁶
IDD
RH conversion in progress
—
Temperature conversion in progress
—
Standby, –40 to +85 °C²
—
Standby, –40 to +125 °C²
—
Peak IDD during powerup³
—
Peak IDD during I²C operations⁴
—
After writing to user registers⁵
—
I_HEAT
—
150
180 μA
90
120 μA
0.06
0.62 μA
0.06
3.8
μA
3.5
4.0
mA
3.5
4.0
mA
20
—
μA
3.1
—
mA
Notes:
1. Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will
be t_CONV(RH) + t_CONV(T).
2. No conversion or I²C transaction in progress. Typical values measured at 25 °C.
3. Occurs once during powerup. Duration is <5 msec.
4. Occurs during I²C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration
is <100 μs when I²C clock speed is >100 kHz (>200 kHz for 2-byte commands).
5. IDD after a user register write. Initiating any other subsequent I²C transaction on the same bus (such as the user
register read, starting an RH measurement, or traffic directed at other I²C devices) will transition the device to standby
mode.
6. Additional current consumption when HTRE bit enabled. See Section “5.5. Heater” for more information
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Rev. 1.1