EFR32BG12P232F Datasheet, PDF (173/181 Pages) Silicon Laboratories – EFR32BG12 Blue Gecko Bluetooth ®Low Energy SoC Family Data Sheet

EFR32BG12 Blue Gecko Bluetooth ^®Low Energy SoC Family Data Sheet
BGA125 Package Specifications
Table 7.2. BGA125 PCB Land Pattern Dimensions
Dimension
Min
Nom
Max
X
0.25
C1
6.00
C2
6.00
E1
0.5
E2
0.5
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1.
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
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