SI3019-F-FSR Datasheet, PDF (110/128 Pages) Silicon Laboratories – PROGRAMMABLE VOICE DAA SOLUTIONS

Si3050 + Si3011/18/19
10.1. PCB Land Pattern: Si3050 TSSOP
Figure 55. 20-Pin Thin Shrink Small Outline Package (TSSOP) PCB Land Pattern
Table 29. 20-Pin Thin Shrink Small Outline Package (TSSOP) PCB Land Pattern Dimensions
Dimension
C1
Feature
Pad Column Spacing
(mm)
5.80
E
Pad Row Pitch
0.65
X1
Pad Width
0.45
Y1
Pad Length
1.40
Notes:
1. This Land Pattern Design is based on IPC-7351
specifications for Density Level B (Median Land Protrusion).
2. All feature sizes shown are at Maximum Material Condition
(MMC) and a card fabrication tolerance of 0.05 mm is
assumed.
110
Rev. 1.5