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SI53314 Datasheet, PDF (10/32 Pages) Silicon Laboratories – 1:6 LOW JITTER UNIVERSAL BUFFER/LEVEL
Si53314
Table 13. Thermal Conditions
Parameter
Thermal Resistance,
Junction to Ambient
Thermal Resistance,
Junction to Case
Symbol
JA
JC
Test Condition
Still air
Still air
Value
49.6
32.3
Unit
°C/W
°C/W
Table 14. Absolute Maximum Ratings
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Storage Temperature
Supply Voltage
Input Voltage
Output Voltage
ESD Sensitivity
TS
VDD
VIN
VOUT
HBM
HBM, 100 pF, 1.5 k
–55
—
150
C
–0.5
—
3.8
V
–0.5
—
VDD+ 0.3
V
—
—
VDD+ 0.3
V
—
—
2000
V
ESD Sensitivity
CDM
—
—
500
V
Peak Soldering
TPEAK Pb-Free; Solder reflow profile
—
—
260
C
Reflow Temperature
per JEDEC J-STD-020
Maximum Junction
TJ
Temperature
—
—
125
C
Note: Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation
specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended
periods may affect device reliability.
10
Rev. 1.0