S1172 Datasheet, PDF (7/35 Pages) Seiko Instruments Inc – HIGH RIPPLE-REJECTION LOW DROPOUT

Rev.2.2_01
HIGH RIPPLE-REJECTION LOW DROPOUT HIGH OUTPUT CURRENT CMOS VOLTAGE REGULATOR
S-1172 Series
Power Dissipation of HSOP-6 (Reference)
Power dissipation of package differs depending on the mounting conditions.
Consider the power dissipation characteristics under the following conditions as reference.
[Mounted board]
(1) Board size:
(2) Board material:
(3) Wiring ratio:
(4) Test conditions:
(5) Land pattern:
50 mm × 50 mm × t1.6 mm
Glass epoxy resin (two layers)
90%
When mounted on board (wind speed : 0 m/s)
Refer to the recommended land pattern (drawing code : FH006-A-L-SD)
2400
2000
1600
1200
800
400
0
0
50
100
150
Ambient temperature (Ta) [°C]
Figure 5 Power Dissipation of Package (When Mounted on Board)
Condition
HSOP-6 (When mounted on board)
Table 6
Power Dissipation (Reference)
2000 mW
Thermal Resistance Value (θj−a)
50°C/W
Seiko Instruments Inc.
7