S-24C04BPHAL Datasheet, PDF (27/38 Pages) Seiko Instruments Inc – 2-WIRE CMOS SERIAL E2PROM

Rev.2.1_00
2-WIRE CMOS SERIAL E²PROM
S-24C04BPHAL
„ Precautions
• Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in
electrostatic protection circuit.
• SII claims no responsibility for any and all disputes arising out of or in connection with any infringement
of the products including this IC upon patents owned by a third party.
„ Precautions for WLP package
• The side of device silicon substrate is exposed to the marking side of device package. Since this portion
has lower strength against the mechanical stress than the standard plastic package, chip, crack, etc
should be careful of the handing of a package enough. Moreover, the exposed side of silicon has
electrical potential of device substrate, and needs to be kept out of contact with the external potential.
• In this package, the overcoat of the resin of translucence is carried out on the side of device area. Keep
it mind that it may affect the characteristic of a device when exposed a device in the bottom of a high
light source.
Seiko Instruments Inc.
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