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TLE4207 Datasheet, PDF (13/14 Pages) Siemens Semiconductor Group – 1-A Dual-HBD (Dual-Half-Bridge Driver)
TLE 4207
Package Outlines
P-DSO-14-4
(Plastic Dual Small Outline Package)
0.35 x 45˚
4
1)
-0.2
1.27
0.35 +0.15 2)
14
0.1
0.2 14x
8
0.4 +0.8
6 ±0.2
1
7
8.75
1)
-0.2
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
GPS05093
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”.
SMD = Surface Mounted Device
Semiconductor Group
13
Dimensions in mm
1998-02-01