ZXTC2061E6 Datasheet, PDF (2/8 Pages) Zetex Semiconductors – 12V, SOT23-6, complementary medium power transistors

ZXTC2061E6
Absolute Maximum Ratings – Q1 (NPN Transistor) (@TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulsed Collector Current
Base Current
Symbol
VCBO
VCEO
VEBO
IC
ICM
IB
Value
20
12
7
5
12
1
Unit
V
V
V
A
A
A
Absolute Maximum Ratings – Q2 (PNP Transistor) (@TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulsed Collector Current
Base Current
Symbol
VCBO
VCEO
VEBO
IC
ICM
IB
Value
-12
-12
-7
-3.5
-10
-1
Unit
V
V
V
A
A
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
(Notes 5 & 9)
Symbol
Power Dissipation
Linear Derating Factor
(Notes 6 & 9)
(Notes 6 & 10)
PD
(Notes 7 & 9)
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Operating and Storage Temperature Range
(Notes 8 & 9)
(Notes 5 & 9)
(Notes 6 & 9)
(Notes 6 & 10)
(Notes 7 & 9)
(Notes 8 & 9)
(Note 11)
RθJA
RθJL
TJ, TSTG
Value
0.7
5.6
0.9
7.2
1.1
8.8
1.1
8.8
1.7
13.6
179
139
113
113
73
87.58
-55 to +150
Unit
W
mW/°C
°C/W
°C
ESD Ratings (Note 12)
Characteristic
Electrostatic Discharge - Human Body Model
Electrostatic Discharge - Machine Model
Symbol
ESD HBM
ESD MM
Value
4,000
400
Unit
JEDEC Class
V
3A
V
C
Notes:
5. For a device surface mounted on 15mm x 15mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured
when operating in a steady-state condition.
6. Same as Note 5, except the device is surface mounted on 25mm x 25mm 1oz copper.
7. Same as Note 5, except the device is surface mounted on 50mm x 50mm 2oz copper.
8. Same as Note 7, except the device is measured at t < 5 seconds.
9. For device with one active die, both collectors attached to a common heatsink.
10. For device with two active dice running at equal power, split heatsink 50% to each collector.
11. Thermal resistance from junction to solder-point (at the end of the collector lead).
12. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
ZXTC2061E6
Document Number: DS33646 Rev: 3 - 2
2 of 8
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November 2015
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