GP2S700HCP Datasheet, PDF (9/13 Pages) Sharp Electrionic Components – SMT, Detecting Distance : 3mm Phototransistor Output, Compact Refl ective Photointerrupter

● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please solder within one time.
MAX
240˚C
200˚C
1 to 4˚C/s
MAX
160˚C
GP2S700HCP
1 to 4˚C/s
1 to 4˚C/s
25˚C
MAX120s
MAX10s
MAX60s
MAX90s
Other notice
Please take care not to let any external force exert on lead pins.
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
Sheet No.: D3-A02201EN
9