GP2W0106YP Datasheet, PDF (11/16 Pages) Sharp Electrionic Components – 115 kbps Transceiver

115 kbps Transceiver
GP2W0106YP
OUTGOING INSPECTION
• Inspection lot: Inspection shall be carried out per
each delivery lot.
• Inspection method: A single sampling plan, normal
inspection level two based on ISO 2859 shall be
adopted.
Table 2. Outgoing Inspection
PARAMETER
INSPECTION ITEMS AND
TEST METHOD
Disconnection, short
Major defect
Inverse polarity on terminal
Soldering defect (obstacle to
use)
Electrical characteristic defect
Minor defect
Appearance defect which
affects the electrical character-
istics such as, split, chip,
scratch, stain, or blur
AQL(%)
0.1
0.1
0.1
0.1
0.25
PRECAUTIONS FOR SOLDERING
Solder Reflow
Solder only once at the temperature and the time
within the temperature profile as shown in Figure 16.
Other Precautions
An infrared lamp used to heat up for soldering may
cause a localized temperature rise in the resin. Keep the
package temperature within that specified in Figure 16.
Also avoid immersing the resin part in the solder. Even if
within the temperature profile shown in Figure 16, there
is the possibility that the gold wire in the package may
break if the deformation of the PCB affects the lead pins.
Use after fully confirming the conditions of actual solder
reflow machine.
Soldering
• Soldering iron shall be less than 25 W, and temper-
ature of soldering iron point shall be used at less
than 260°C.
• Soldering time shall be within 5 seconds.
• Soldered product shall treat at normal temperature.
• Solder: 6/4 solder or included Ag solder.
230°C
MAX.
200°C
165°C
MAX.
1 - 4°C/s
1 - 4°C/s
1 - 4°C/s
25°C
IrDA Data Sheet
120 s MAX.
5 s MAX.
60 s MAX.
90 s MAX.
Figure 16. Temperature Profile
GP2W0106YP-16
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