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PR33MF51NSZF Datasheet, PDF (10/14 Pages) Sharp Electrionic Components – Non-Zero Cross type DIP 8pin Triac output SSR
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering :
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
(package surface : 250˚C peak)
PR33MF51NSZF Series
200
100
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
0
0
1
2
3
4
(min)
Flow Soldering (No Solder bathing)
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400̊C.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D4-A03901EN
10