SGM4866 Datasheet, PDF (9/12 Pages) SG Micro Corp – 1.28W Stereo Audio Power Amplifier

SGM4866
1.28W Stereo Audio Power Amplifier
APPLICATION NOTE
PCB Design Recommendations (Thermal Design Considerations)
Thermal Vias
SGM4866 is capable of delivering 2.05W of continuous average power per channel into a 4Ω bridge tied load (BTL) with
typically 1% distortion (THD+N) from a 5V power supply, but thermal vias are necessary. They conduct heat from the
exposed pad of the package to the ground plane. The number of vias is application specific and is dependent upon
electrical requirements and power dissipation.
The via diameter should be 0.2mm to 0.33mm with 1oz. copper via barrel plating. It is important to plug the via to avoid
any solder wicking inside the via during the soldering process. The thermal vias can be tented with solder mask on the
top surface of the PCB. The solder mask diameter should be at least 75microns (or 3mils) larger than the via diameter.
The solder mask thickness should be the same across the entire PCB.
A package thermal performance may be improved by increasing the number of vias.
SG Micro Corp
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