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SGM706 Datasheet, PDF (2/12 Pages) SG Micro Corp – Low-Cost, Microprocessor Supervisory Circuit | |||
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SGM706
Low-Cost, Microprocessor
Supervisory Circuit
PACKAGE/ORDERING INFORMATION
MODEL
SGM706
RESET
THRESHOLD (V)
4.65
4.40
4.0
3.08
2.93
2.63
PACKAGE
DESCRIPTION
SOIC-8
SOIC-8
SOIC-8
SOIC-8
SOIC-8
SOIC-8
ORDERING
NUMBER
SGM706-LYS8G/TR
SGM706-MYS8G/TR
SGM706-JYS8G/TR
SGM706-TYS8G/TR
SGM706-SYS8G/TR
SGM706-RYS8G/TR
PACKAGE
MARKING
SGM706-LYS8
SGM706-MYS8
SGM706-JYS8
SGM706-TYS8
SGM706-SYS8
SGM706-RYS8
PACKAGE
OPTION
Tape and Reel, 2500
Tape and Reel, 2500
Tape and Reel, 2500
Tape and Reel, 2500
Tape and Reel, 2500
Tape and Reel, 2500
NOTE: Order number is defined as the follow:
ORDER NUMBER
SGM 706- X Y X G / TR
Tape and Reel
Green product
Package Type
S8 SOIC-8
Operating Temperature Range
Y
-40â to +85â
RESET THRESHOLD
L: 4.65V
M:4.40V
J: 4.0V
T: 3.08V
S: 2.93V
R: 2.63V
ABSOLUTE MAXIMUM RATINGS
(Typical values are at TA = +25â, unless otherwise noted.)
Terminal Voltage (with respect to GND)
VCC....................................................................... -0.3V to 6.0V
All Other Inputs........................................ -0.3V to (VCC + 0.3V)
Input Current, VCC..............................................................20mA
GND................................................................................. 20mA
Output Current, (all outputs).............................................. 20mA
Operating Temperature Range........................... -40â to +85â
Junction Temperature....................................................... 150â
Storage Temperature........................................ -65â to +150â
Lead Temperature (Soldering, 10sec).............................. 260â
ESD Susceptibility
HBM..................................................................................4000V
MM......................................................................................300V
CAUTION
This integrated circuit can be damaged by ESD if you donât pay
attention to ESD protection. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because
very small parametric changes could cause the device not to
meet its published specifications.
SGMICRO reserves the right to make any change in circuit
design, specification or other related things if necessary without
notice at any time. Please contact SGMICRO sales office to get
the latest datasheet.
NOTE:
Stresses beyond those listed under âAbsolute Maximum
Ratingsâ may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at
these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
SG Micro Corp
2
www.sg-micro.com
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