YGUR302TM_12 Datasheet, PDF (9/13 Pages) Seoul Semiconductor – Surface-mounted chip LED device

7. Outline Dimension
2.50
1.50
2
4
1.40
0.90
㎜ Tolerance ± 0.1, Unit :
2.50
0.90
1
3
0.80
1.80
(0.5)
0.60
[ TOP VIEW]
[ SIDE VIEW]
[ BOTTOM VIEW]
Cathode
2
4
3.30
1.40
YG
UR
1
3
Anode
0.50
[ Rec om m anded Solder Pattern]
8. Material
Item
Substrate
Chip (YG/UR)
Material BT-Resin PCB
GaP / AlGaAs
wire Encapsulate Electrode
Gold
Epoxy
Au Plated
Rev. 02
January 2012
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서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)