YGUR302TM_12 Datasheet, PDF (12/13 Pages) Seoul Semiconductor – Surface-mounted chip LED device

11. Soldering profile
(1) Lead Solder
Pre-heat
Lead Solder
℃ 120~150
Pre-heat time
Peak-Temperature
120 sec. Max.
℃ 240 Max.
Soldering time
Condition
10 sec. Max.
2.5~5 C / sec.
Lead Solder
2.5~5o C / sec.
240 ^oC Max.
10 sec. Max.
Pre-heating
120~150 ^oC
60sec. Max.
Above 200 ^oC
120sec. Max.
(2) Lead-Free Solder
Lead Free Solder
Pre-heat
℃ 150~200
Pre-heat time
Peak-Temperature
120 sec. Max.
℃ 260 Max.
Soldering time
Condition
10 sec. Max.
1~5 ^oC / sec.
Lead-frame Solder
1~5 ^oC / sec.
260 ^oC Max.
10 sec. Max.
Pre-heating
150~200 ^oC
60sec. Max.
Above 220oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process,
we don’t guarantee the products.
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)