THBFR411 Datasheet, PDF (9/13 Pages) Seoul Semiconductor – Small size suitable for compact appliances

7. Outline Dimension
1.5
24
Marking
13
0.2
0.8
(0.18)
Resin
PCB
0.5
㎜ Tolerance ± 0.1, Unit :
0.2
0.6
Cathode
24
Blue
Red
13
Anode
0.2
1.8
[ Recommended Solder Pattern]
8. Material
Item
Substrate
Chip (B/R)
Material BT-Resin PCB InGaN/AlInGaP
wire
Gold
Encapsulate Electrode
Epoxy
Au Plated
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)