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| YGUR302TM Datasheet, PDF (6/9 Pages) Seoul Semiconductor – Surface-mounted and leadless chip LED device | |||
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4. Soldering profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
⢠Preliminary heating to be at 150 max. for 2 minutes max.
⢠Soldering heat to be at 240 max. for 5 seconds max.
(2) Lead-Free Solder
⢠Preliminary heating to be at 150 max. for 2 minutes max.
⢠Soldering heat to be at 260 max. for 10 seconds max.
(3) Hand Soldering Condition
⢠Not more than 3 seconds @MAX280 , under Soldering iron.
[Note] In case the soldered products are reused in soldering process, we donât guarantee the products.
SSC-YGUR302TM
Revision 1.0
www.ZLED.com
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