UR101 Datasheet, PDF (6/9 Pages) Seoul Semiconductor – Surface-mounted and leadless chip LED device

4. Soldering profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
• Preliminary heating to be at 150℃max. for 2 minutes max.
• Soldering heat to be at 240 ± 5℃max. for 5 seconds max.
°C
Operation heating
240
150
Pre-heating
Temperature
rise: 5°C/sec.
120
Cooling:
-5°C/sec.
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
• Preliminary heating to be at 150℃max. for 2 minutes max.
• Soldering heat to be at 255℃(+5/-0)℃max. for 10 seconds max.
°C
255
(+5)
Operation heating
150
Temperature
Pre-heating rise: 5°C/sec.
120
Cooling:
-5°C/sec.
0
60 to 120 sec.
5 to 10 sec.
(3) Hand Soldering Condition
• Not more than 3 seconds @MAX280℃, under Soldering iron.
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
November 2007
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)