HBTGFR421-S Datasheet, PDF (4/7 Pages) Seoul Semiconductor – CHIP LED DEVICE

5. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 240℃max. for 5 seconds max.
°C
Operation heating
240
150
Pre-heating
Temperature
rise: 5°C/sec.
120
Cooling:
-5°C/sec.
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 255℃max. for 20 seconds max.
°C
255
(+5)
Operation heating
150
Pre-heating
Temperature
rise: 5°C/sec.
120
Cooling:
-5°C/sec.
0
60 to 120 sec.
10 to 20 sec.
(3) Hand Soldering conditions
-Not more than 3 seconds @MAX280℃, under Soldering iron.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: [phone] FAX: [phone]
- 4/7-
HBTGFR421-S