SAW8WA2A Datasheet, PDF (21/23 Pages) Seoul Semiconductor – White colored SMT package

9. Soldering
IPC/JEDEC J-STD-020
Profile Feature
Average ramp-up rate (Tsmax to Tp)
Sn-Pb Eutectic Assembly
3° C/second max.
Pb-Free Assembly
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)2
Ramp-down Rate
Time 25°C to Peak Temperature
183 °C
60-150 seconds
215℃
10-30 seconds
6 °C/second max.
6 minutes max.
217 °C
60-150 seconds
260℃
20-40 seconds
6 °C/second max.
8 minutes max.
* Caution
1. Reflow soldering is recommended not to be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be
damaged.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
REV.02
Jan 2013
www.seoulsemicon.com
21
서식번호 : SSC-QP-7-07-12 (Rev.01)