ERT801-S Datasheet, PDF (11/13 Pages) Seoul Semiconductor – Industry Standard PLCC SMT package Available in multiple colors

9. soldering
(1) Lead Solder
Lead Solder
Pre-heat
120~150℃
Pre-heat time
120 sec. Max.
Peak-Temperature
240℃ Max.
Soldering time Condition 10 sec. Max.
2.5~5 C / sec.
Lead Solder
2.5~5o C / sec.
240 ^oC Max.
10 sec. Max.
Pre-heating
120~150 ^oC
60sec. Max.
Above 200 ^oC
120sec. Max.
(2) Lead-Free Solder
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec. Max.
Peak-Temperature
260℃ Max.
Soldering time Condition
10 sec. Max.
1~5 ^oC / sec.
Lead-frame Solder
1~5 ^oC / sec.
260 ^oC Max.
10 sec. Max.
Pre-heating
150~200 ^oC
60sec. Max.
Above 220 ^oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter, the picking up nozzle that does not affect the silicone
resign should be used.
(5) It is recommended that the customer use the nitrogen reflow method.
(6) Repairing should not be done after the LEDs have been soldered.
(7) Reflow soldering should not be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be damaged.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
September 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)