E2801 Datasheet, PDF (2/2 Pages) Semtech Corporation – GR-253-Core SMC (SONET minimum clock) and ITU G.813 Option 2 Minature Surface Mount TCXO

Outline in mm
7.0±0.15
2.54
1.0±0.20
10
1
234
98 ^{7 65}
0.6
Pad Connections
1.Do not connect
2.N/C
3.Do not connect
4.GND
5.Output
6.N/C
7.N/C
8.Tri-state Control*
9.Supply, +Vs
10.Do not connect,
or connect to GND
*Leave unconnected if
not required
2.0
Lead Free Reflow Soldering Profile *
Time above 217°C: 60 to 150 secs
300
Time 25°C to Peak Temp: 480 sec max
Peak Temp
260°C
+0
-5
°C
20 to 40 sec
200
150°C to 200°C
60 to 180 seconds
100
50
Tin / Lead Reflow Soldering Profile *
Time above 183°C: 60 to 150 secs
300
Time 25°C to Peak Temp: 360 sec max
Peak Temp
240°C
+0
-5
°C
10 to 30 sec
200
100°C to 150°C
60 to 120 seconds
100
50
*Note:
These profiles were used during
the qualification
testing of the product and
therefore represent worst
case conditions. They are not
recommended for use
by the customer in the actual
assembly of these parts