SLVU2.8 Datasheet, PDF (5/7 Pages) Semtech Corporation – Low Voltage EPD TVS Diode For ESD and Latch-Up Protection

SLVU2.8
Bidirectional Common-Mode Protection (Figure 10)
Two SLVU2.8 devices provide one line of bidirectional
protection in a common-mode configuration as depicted
in figure 10.
Circuit connectivity is as follows:
z Line 1 is connected to Pin1 of Device 1 & Pin 2 of Device 2
z Pin 2 of Device 1 and Pin 1 of Device 2 are connected to ground
z Pin 3 of both devices is not connected
Fig10.
Bidirectional Differential-Mode Protection (Figure 11)
Two SLVU2.8 devices provide up to two lines of
bidrectional protection in a differenitalmode configuration
as depicted in figure 11.
Circuit connectivity is as follows:
z Line 1 is connected to Pin1 of Device 1 & Pin 2 of Device 2
z Line 2 is connected to Pin 2 of Device 1 & Pin 1 of Device 2
Fig11.
Circuit Board Layout Protection
Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following
guidelines are recommended:
z The protection device should be placed near the input terminals or connectors, the device will divert
the transient current immediately before it can be coupled into the nearby traces.
z The path length between the TVS device and the protected line should be minimized.
z All conductive loops including power and ground loops should be minimized.
z The transient current return path to ground should be kept as short as possible to reduce parasitic
inductance.
z Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.
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