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SKM25GAH125D Datasheet, PDF (2/5 Pages) Semikron International – IGBT Modules
SKM25GAH125D
SEMITRANS® 6
IGBT Modules
SKM25GAH125D
Target Data
Features
• VCE(sat) with positive temperature
coefficient
• High short circuit capability, self limiting
to 6 x Icnom
• Fast & soft inverse CAL diodes
• Large clearance (10 mm) and
creepage distances (20 mm)
• Isolated copper baseplate using DBC
Technology (Direct Copper Bonding)
• UL recognized, file no. E63532
Typical Applications*
• DC/DC – converter
• Brake chopper
• Switched reluctance motor
• DC – motor
Characteristics
Symbol
td(on)
tr
Eon
td(off)
tf
Conditions
VCC = 600 V
IC = 25 A
VGE = ±15 V
RG on = 16 
RG off = 16 
Tj = 125 °C
Tj = 125 °C
Tj = 125 °C
Tj = 125 °C
Tj = 125 °C
Eoff
Tj = 125 °C
Rth(j-c)
per IGBT
Inverse diode
VF = VEC
IF = 40 A
VGE = 0 V
chiplevel
Tj = 25 °C
Tj = 125 °C
VF0
chiplevel
Tj = 25 °C
Tj = 125 °C
rF
IRRM
Qrr
Err
Rth(j-c)
chiplevel
IF = 25 A
VGE = ±15 V
VCC = 600 V
per diode
Tj = 25 °C
Tj = 125 °C
Tj = 125 °C
Tj = 125 °C
Tj = 125 °C
Freewheeling diode
VF = VEC
IF = 40 A
VGE = 0 V
chiplevel
Tj = 25 °C
Tj = 125 °C
VF0
chiplevel
Tj = 25 °C
Tj = 125 °C
rF
IRRM
Qrr
Err
Rth(j-c)
chiplevel
Tj = 25 °C
Tj = 125 °C
IF = 25 A
Tj = 125 °C
di/dtoff = 2500 A/µs
VGE = ±15 V
Tj = 125 °C
VCC = 600 V
Tj = 125 °C
per Diode
Module
LCE
RCC'+EE'
terminal-chip
TC = 25 °C
TC = 125 °C
Rth(c-s)
per module
Ms
to heat sink M6
Mt
w
min.
typ.
max. Unit
25
ns
19
ns
3.9
mJ
184
ns
8
ns
1.6
mJ
0.56 K/W
2.13
2.65
V
1.94
2.46
V
1.1
1.45
V
0.85
1.2
V
25.7
30.0 m
27.1
31.4 m
A
µC
mJ
1
K/W
2.00
2.5
V
1.8
2.3
V
1.1
1.45
V
1.18
1.2
V
22.5
30.0 m
27.1
31.4 m
50
A
4
µC
1.1
mJ
1
K/W
60
nH
m
m
0.05 K/W
4
5
Nm
Nm
Nm
175
g
GAH
2
Rev. 1 – 05.12.2012
© by SEMIKRON