SEMIX353GB176HDS_09 Datasheet, PDF (2/6 Pages) Semikron International – Trench IGBT Modules

SEMiX353GB176HDs
SEMiX^® 3s
Trench IGBT Modules
SEMiX353GB176HDs
Features
• Homogeneous Si
• Trench = Trenchgate technology
• V_CE(sat) with positive temperature
coefficient
• UL recognised file no. E63532
Typical Applications*
• AC inverter drives
• UPS
• Electronic welders
Characteristics
Symbol Conditions
Inverse diode
V_F = V_EC
I_F = 225 A
V_GE = 0 V
chip
T_j = 25 °C
T_j = 125 °C
V_F0
r_F
I_RRM
Q_rr
E_rr
R_th(j-c)
T_j = 25 °C
T_j = 125 °C
T_j = 25 °C
T_j = 125 °C
I_F = 225 A
T_j = 125 °C
di/dt_off = 4000 A/µs
V_GE = -15 V
T_j = 125 °C
V_CC = 1200 V
T_j = 125 °C
per diode
Module
L_CE
R_CC'+EE'
res., terminal-chip ^{TC = 25 °C}
T_C = 125 °C
R_th(c-s)
M_s
M_t
per module
to heat sink (M5)
to terminals (M6)
w
Temperatur Sensor
R₁₀₀
B_100/125
T_c=100°C (R₂₅=5 kΩ)
R_(T)=R₁₀₀exp[B_100/125(1/T-1/T₁₀₀)];
T[K];
min.
typ.
max. Unit
1.6
1.75
V
1.5
1.7
V
0.9
1.1
1.3
V
0.7
0.9
1.1
V
2.0
2.0
2.0
mΩ
2.7
2.7
2.7
mΩ
280
A
83
µC
45
mJ
0.13 K/W
20
nH
0.7
mΩ
1
mΩ
0.04
K/W
3
5
Nm
2.5
5
Nm
Nm
300
g
493 ± 5%
Ω
3550
±2%
K
GB
2
Rev. 12 – 16.12.2009
© by SEMIKRON