SKYPER32R_0701 Datasheet, PDF (15/16 Pages) Semikron International – IGBT Driver Core

SKYPER™ 32 R
Mounting Notes
Soldering Hints
Drill Hole & Pad Size in mm
The temperature of the solder must not exceed 260°C, and solder time must
not exceed 10 seconds.
The ambient temperature must not exceed the specified maximum storage
temperature of the driver.
The solder joints should be in accordance to IPC A 610 Revision D (or later) -
Class 3 (Acceptability of Electronic Assemblies) to ensure an optimal
connection between driver core and printed circuit board.
Please note:
The driver is not suited for hot air reflow or infrared reflow processes.
The connection between driver core and printed circuit board should be mechanical reinforced by using support posts.
Use of Support Posts
Product information of suitable support posts and
distributor contact information is available at e.g.
http://www.richco-inc.com (e.g. series DLMSPM,
LCBST).
Please note:
The use of agressive materials in cleaning and potting process of driver core may be detrimental for the device parameters. If the driver
core is coated by the user, any warranty (Gewährleistung) expires.
Environmental Conditions
The driver core is type tested under the environmental conditions below.
Conditions
Vibration
Shock
Values (max.)
Sinusoidal sweep 20Hz … 500Hz, 5g, 26 sweeps per axis (x, y, z)
- Tested acc. IEC 68-2-6
- Connection between driver core and printed circuit board mechanical reinforced by using support posts.
Half-sinusoidal pulse, 5g, shock width 18ms, 3 shocks in each direction (±x, ±y, ±z), 18 shocks in total
- Tested acc. IEC 68-2-27
- Connection between driver core and printed circuit board mechanical reinforced by using support posts.
The characteristics and further environmental conditions are indicated in the data sheet.
15
2007-01-19 – Rev05
© by SEMIKRON