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SGM3055_15 Datasheet, PDF (2/4 Pages) SeCoS Halbleitertechnologie GmbH – N-Channel Enhancement Mode Power MOSFET
Elektronische Bauelemente
SGM3055
5.8A , 30V , RDS(ON) 28 m
N-Channel Enhancement Mode Power MOSFET
ELECTRICAL CHARACTERISTICS (TJ=25°C unless otherwise specified)
Parameter
Symbol Min. Typ. Max. Unit
Teat Conditions
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Gate Threshold Voltage
Gate-Source Leakage Current
Drain-Source Leakage Current TJ=25°C
TJ=55°C
Static Drain-Source On-Resistance 2
Total Gate Charge 2
Gate-Source Charge
Gate-Drain (“Miller”) Charge
Turn-on Delay Time 2
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
BVDSS
△BVDSS /△TJ
VGS(th)
IGSS
IDSS
RDS(ON)
Qg
Qgs
Qgd
Td(on)
Tr
Td(off)
Tf
Ciss
Coss
Crss
30
-
-
V VGS=0, ID=250μA
- 0.021 -
V / °C Reference to 25°C, ID=1mA
1.2 -
2.5
-
- ±100
-
-
1
-
-
5
-
-
28
-
-
40
-
6
8.4
- 2.5 3.5
- 2.1 2.9
- 2.4 4.8
- 7.8 14
-
22
44
-
4
8
- 572 800
-
81 112
-
65
91
V VDS=VGS, ID=250μA
nA VGS= ±20V
μA VDS=24V, VGS=0
VDS=24V, VGS=0
mΩ VGS=10V, ID=5A
VGS=4.5V, ID=4A
ID=5A
nC VDS=15V
VGS=4.5V
VDD=15V
ID=5A
nS VGS=10V
RG=3.3Ω
RD=1.9Ω
VGS=0
pF VDS=15V
f=1.0 MHz
Source-Drain Diode
Forward On Voltage2
VSD
-
-
1.2
V IS=3A, VGS=0, TJ=25°C
Continuous Source Current(Body Diode) 1.4
IS
Pulsed Source Current(Body Diode) 2.4
ISM
-
-
5.8
A
VD=VG=0, VS=1.2V
-
-
30
A
Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3. The power dissipation is limited by 150°C junction temperature
4. The data is theoretically the same as ID and IDM , in real applications, should be limited by total power dissipation.
http://www.SeCoSGmbH.com/
29-May-2012 Rev. C
Any changes of specification will not be informed individually.
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