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SSG4536C_15 Datasheet, PDF (1/2 Pages) SeCoS Halbleitertechnologie GmbH – N & P-Ch Enhancement Mode Power MOSFET
Elektronische Bauelemente
SSG4536C
N-Ch: 7.1A, 30V, RDS(ON) 28 mΩ
P-Ch: -6A, -30V, RDS(ON) 39 mΩ
N & P-Ch Enhancement Mode Power MOSFET
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
DESCRIPTION
These miniature surface mount MOSFETs
utilize a high cell density trench process to provide low
RDS(on) and to ensure minimal power loss and heat
dissipation.
FEATURES
Low RDS(on) provides higher efficiency and
extends battery life.
Low thermal impedance copper leadframe
SOP-8 saves board space
Fast switching speed
High performance trench technology
APPLICATION
DC-DC converters and power management in
portable and battery-powered products such as computers,.
printers, PCMCIA cards, cellular and cordless telephones
PACKAGE INFORMATION
Package
MPQ
SOP-8
2.5K
Leader Size
13 inch
SOP-8
B
LD
M
A
H
G
C
N
JK
FE
REF.
A
B
C
D
E
F
G
Millimeter
Min. Max.
5.8 6.20
4.80 5.00
3.80 4.00
0°
8°
0.50 0.93
0.19 0.25
1.27 TYP.
REF.
H
J
K
L
M
N
Millimeter
Min. Max.
0.35 0.51
0.375 REF.
45°
1.35 1.75
0.10 0.25
0.25 REF.
Top View
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)
Parameter
Symbol
N-CH
Rating
P-CH
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current 1
TA = 25°C
TA = 70°C
Pulsed Drain Current 2
Continuous Source Current (Diode Conduction) 1
Total Power Dissipation 1
TA = 25°C
TA = 70°C
Operating Junction & Storage Temperature Range
VDS
VGS
ID
IDM
IS
PD
TJ, TSTG
30
-30
±20
±20
7.1
-6
5.8
-4.9
20
-20
1.3
-1.3
2.1
1.3
-55 ~ 150
Thermal Resistance Ratings
Maximum Junction-to-Ambient 1 t≦10 sec
RθJA
Steady State
Notes:
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
62.5
110
Unit
V
V
A
A
A
A
W
W
°C
°C / W
°C / W
http://www.SeCoSGmbH.com/
12-Sep-2012 Rev. A
Any changes of specification will not be informed individually.
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