LV8406T_12 Datasheet, PDF (3/6 Pages) Sanyo Semicon Device – 2ch Forward/Reverse Motor Driver

Package Dimensions
unit : mm (typ)
3279
TOP VIEW
6.5
20
11
LV8406T
4,0
BOTTOM VIEW
3.1
3.0
Pd max -- Ta
Specified board: 90×90×1.6mm³
glass epoxy 2-layer (2S0P)
with components mounted
on the exposed die-pad board.
1
0.65
(0.33)
10
0.22
SIDE VIEW
0.15
Exposed Die-Pad
SANYO : TSSOP20J(225mil)
2.0
1.61
1.0
0
-30 -20
0
20
40
60
8085 100
Ambient temperature, Ta -- °C
Substrate Specifications
Size
: 90mm × 90mm × 1.6mm (2-layer substrate [2S0P])
Material
: Glass epoxy
Copper wiring density : L1 = 95% / L2 = 95%
L1 : Copper wiring pattern diagram
L2 : Copper wiring pattern diagram
Cautions
1) The data for the case with the Exposed Die-Pad substrate mounted shows the values when 90% or more of the
Exposed Die-Pad is wet.
2) For the set design, employ the derating design with sufficient margin.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such as
vibration, impact, and tension. Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below :
(1)Maximum value 80% or less for the voltage rating
(2)Maximum value 80% or less for the current rating
(3)Maximum value 80% or less for the temperature rating
3) After the set design, be sure to verify the design with the actual product.
Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.
Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction,
possibly resulting in thermal destruction of IC.
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