LSS Datasheet, PDF (7/8 Pages) Samtec, Inc – 0,635mm (.025”) Razor Beam™ High Speed Hermaphroditic Terminal/Socket Strip

Product Specification
Series: LSS 0,635mm (.025”) Razor Beam™ High Speed Hermaphroditic Terminal/Socket Strip
7.3 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec
does not specify a recommended reflow profile for our connectors. The processing parameters provided by the
solder paste manufacturer should be employed and can usually be found on their website.
All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile
parameters detailed in IPC/JEDEC J-STD-020E which requires that components be capable of withstanding a peak
temperature of 260°C as well as 30 seconds above 255°C.
Samtec Recommended Temperature Profile Ranges (SMT)
Sn-Pb Eutectic Assembly
Preheat/Soak
(100°C-150°C)
60-120 sec.
Max Ramp Up Reflow Time
Rate
(above 183°C)
3°C/s max.
40-150 sec.
Peak
Temp
235°C
Time within 5°C
of 235°C
20 sec. max.
Max Ramp
Down Rate
6°C/s max.
Time 25°C to
Peak Temp
6 min. max.
Pb-Free Assembly
Preheat/Soak
(150°C-200°C)
60-120 sec.
Max Ramp Up Reflow Time
Rate
(above 217°C)
3°C/s max.
40-150 sec.
Peak
Temp
260°C
Time within 5°C
of 260°C
30 sec. max.
Max Ramp
Down Rate
6°C/s max.
Time 25°C to
Peak Temp
8 min. max.
7.3.1
These guidelines should not be considered design requirements for all applications.
Samtec recommends testing interconnects on your boards in your process to guarantee optimum results.
Revision: C
Date: August 27, 2015
Page 7
© Samtec, Inc.