K9F5608Q0C Datasheet, PDF (5/42 Pages) Samsung semiconductor – 32M x 8 Bit , 16M x 16 Bit NAND Flash Memory

K9F5608Q0C K9F5616Q0C
K9F5608D0C K9F5616D0C
K9F5608U0C K9F5616U0C
FLASH MEMORY
PIN CONFIGURATION (TBGA)
K9F56XXX0C-DCB0,HCB0/DIB0,HIB0
X8
X16
12 3 4 5 6
12 3 4 5 6
N.C N.C
N.C N.C
A ^N.C
B
C
D
E
F
G
H
N.C N.C
/WP ALE Vss /CE /WE R/B
NC /RE CLE NC NC NC
NC NC NC NC NC NC
NC NC NC NC NC NC
NC NC NC NC NC LOCKPRE
NC I/O0 NC NC NC Vcc
NC I/O1 NC VccQ I/O5 I/O7
Vss I/O2 I/O3 I/O4 I/O6 Vss
Top View
N.C N.C
N.C N.C
N.C N.C
N.C N.C
PACKAGE DIMENSIONS
63-Ball TBGA (measured in millimeters)
N.C N.C
N.C N.C
N.C
A
B
C
D
E
F
G
H
N.C N.C
/WP ALE Vss /CE /WE R/B
NC /RE CLE NC NC NC
NC NC NC NC NC NC
NC NC NC NC NC NC
NC NC NC I/O5 I/O7 LOCKPRE
I/O8 I/O1 I/O10 I/O12 IO14 Vcc
I/O0 I/O9 I/O3 VccQ I/O6 I/O15
Vss I/O2 I/O11 I/O4 I/O13 Vss
N.C N.C
N.C N.C
N.C N.C
N.C N.C
Top View
Top View
9.00±0.10
(Datum A)
Bottom View
9.00±0.10
0.80 x 9= 7.20
0.80 x 5= 4.00
0.80
654321
A
B
#A1
A
B
(Datum B) _C
D
E
F
G
H
63-∅0.45±0.05
∅ 0.20 M A B
0.08MAX
2.00
Side View
9.00±0.10
0.45±0.05
5