K4B1G0446E Datasheet, PDF (5/23 Pages) Samsung semiconductor – DDR3 SDRAM Memory

Product Guide
May. 2010
DDR3 SDRAM Memory
4. DDR3 SDRAM Module Product Guide
4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
Org. Density Part Number
Speed
128Mx 64
128Mx 72
256Mx 64
256Mx 72
512Mx 64
512Mx 72
1GB
1GB
2GB
2GB
4GB
4GB
M378B2873EH1
M378B2873FH0
M391B2873EH1
M391B2873FH0
M378B5673EH1
M378B5673FH0
M378B5773CH0
M391B5673EH1
M391B5673FH0
M391B5773CH0
M378B5273BH1
M378B5273CH0
M391B5273BH1
M391B5273CH0
CF8/H9
CF8/H9/K0*
CF8/H9
CF8/H9/K0*
CF8/H9
CF8/H9/K0*
CF8/H9/K0*
CF8/H9
CF8/H9/K0*
CF8/H9/K0*
CF8/H9
CF8/H9/K0*
CF8/H9
CF8/H9/K0*
240Pin DDR3 Unbuffered DIMM
Raw Card
Composition
Comp.
Version
Internal
Banks
128M x 8 * 8 pcs 1Gb E-die
A(1Rx8)
8
128M x 8 * 8 pcs 1Gb F-die
128M x 8 * 9 pcs 1Gb E-die
D(1Rx8)
8
128M x 8 * 9 pcs 1Gb F-die
128M x 8 * 16 pcs 1Gb E-die
B(2Rx8)
8
128M x 8 * 16 pcs 1Gb F-die
A(1Rx8) 256M x 8 * 8 pcs 2Gb C-die
8
128M x 8 * 18 pcs 1Gb E-die
E(2Rx8)
128M x 8 * 18 pcs 1Gb F-die
8
D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die
256M x 8 * 16 pcs 2Gb B-die
B(2Rx8)
8
256M x 8 * 16 pcs 2Gb C-die
256M x 8 * 18 pcs 2Gb B-die
E(2Rx8)
8
256M x 8 * 18 pcs 2Gb C-die
Rank
1
1
2
1
2
1
2
2
1Gx 64 8GB M378B1G73AH0 CF8/H9/K0* B(2Rx8) 512M x 8 * 16 pcs 4Gb A-die
8
2
1Gx 72 8GB M391B1G73AH0 CF8/H9/K0* E(2Rx8) 512M x 8 * 18 pcs 4Gb A-die
8
2
* NOTE : K0(1600Mbps) will be available by ES level
PKG Height Avail.
78 ball
FBGA
30mm
78 ball
FBGA
30mm
Now
Now
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
78 ball
FBGA
30mm
78 ball
FBGA
78 ball
FBGA
30mm
30mm
Now
Now
Now
Now
NOTE
4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)
Org. Density Part Number
128Mx 72
256Mx 72
512Mx 72
1GB
2GB
4GB
M391B2873EH1
M391B2873FH0
M391B5673EH1
M391B5673FH0
M391B5773CH0
M391B5273BH1
M391B5273CH0
Speed
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
240Pin DDR3 Unbuffered DIMM
Raw Card
Composition
Comp.
Version
Internal
Banks
128M x 8 * 9 pcs 1Gb E-die
D(1Rx8)
8
128M x 8 * 9 pcs 1Gb F-die
128M x 8 * 18 pcs 1Gb E-die
E(2Rx8)
8
128M x 8 * 18 pcs 1Gb F-die
D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die
8
256M x 8 * 18 pcs 2Gb B-die
E(2Rx8)
8
256M x 8 * 18 pcs 2Gb C-die
Rank
1
2
1
2
1Gx 72 8GB M391B1G73AH0
YF8/H9
E(2Rx8) 512M x 8 * 18 pcs 4Gb A-die
8
2
* NOTE : 1.35V product is 1.5V operatable.
PKG Height Avail.
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
Now
78 ball
FBGA
30mm
78 ball
FBGA
30mm
Now
Now
NOTE
-5-